招聘人数：1 人
性别要求：不限性别
Responsible for daily operation activities in X-Ray and Soldering process负责X-Ray和Soldering工序的日常事务Responsible for definition, optimize and standardize process document and operation procedure负责制订、优化及标准化本工序的工作流程及文件Responsible for daily production abnormal issue handling and lot disposal in in X-Ray and Soldering process, recover production in time负责X-Ray和Soldering工序生产异常处理，及时恢复生产Responsible for process characterization and machine baseline to understand define the technical requirement负责工艺及设备技术，制订本工序技术标准Lead quality/yield/OEE/Cost related improvement project or task in AL wire bonding and USS process组织并实施本工序的品质、良率、效率相关的改善项目(F) Responsible for Operator certification and training for wire bonding and USS process负责本工序作业员认证及培训Responsible for SPC and APC, channel setup, Cpk tracking and reportingSupport EE to standardize equipment and Spare part specification and documentation, machine maintenance procedure and documentation协助设备工程师完善设备、备件标准及相关设备维护文件 Work with quality engineer for FAR issue与品质工程师合作处理FAR问题Work with project team to support NPI activities 支持新产品、新项目相关事务岗位要求：Bachelor degree in Mechanical, Material or Electrical Engineering or other related areas机械、材料、电子或相关理工科学士学历Master is preferred.硕士优先At least 3 years die bond/ Soldering/ Reflow process, semiconductor power module experience is preferred三年及以上芯片焊接或回流焊接工艺或设备工作经验，半导体模块相关经验优先Strong knowledge of FMEA, SPC, lean-six sigma tools熟练运用FMEA，SPC，六西格玛等工具experience of Die bond/ SMT or other semiconductor process贴片、清洗、X光检查或其他半导体工艺经验
experience of assembly machine maintenance and trouble shooting组装设备维护或故障排除经验Strong knowledge of statistic and data analysis 丰富的统计学知识和数据分析处理能力
求职提醒：求职过程请勿缴纳费用，谨防诈骗！若信息不实请举报。
